Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
| By: | Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao |
| Publisher: | Elsevier S & T |
| Print ISBN: | 9780081025321 |
| eText ISBN: | 9780081025338 |
| Edition: | 0 |
| Format: | Reflowable |
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