Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture and Mechanical Driving Forces
| By: | Wong, E-H; Mai, Y.-W. |
| Publisher: | Elsevier S & T |
| Print ISBN: | 9781845695286 |
| eText ISBN: | 9780857099112 |
| Edition: | 0 |
| Format: | Reflowable |
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