Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
| By: | John Lau; Xuejun Fan |
| Publisher: | Springer Nature |
| Print ISBN: | 9789819641659 |
| eText ISBN: | 9789819641666 |
| Edition: | 0 |
| Format: | Reflowable |
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